Chinese Journal of Computers   Full Text
Title	Simulation on 3-D Glass Isotropic Chemical Etching Process for Microfludic Chip Based on Cellular Automata Model
Authors	DU Li-Qun1) LI Pu2) LIU Jun-Shan3)
Address	1)(Key Laboratory for Precision & Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian, Liaoning 116023) 2)(School of Innovation Experiment, Dalian University of Technology, Dalian, Liaoning 116023) 3)(Key Laboratory for Micro/Nano Technology and System of Liaoning Province, Dalian University of Technology, Dalian, Liaoning 116023)
Year	2008
Issue	No.5(868—874)
Abstract &   Background	Abstract For Isotropic chemical etching properties of glass, an algorithm based on improved continuous cellular automata (CA) model is produced, which develops the traditional CA model. It can be used for wet etching of glass in three-dimensional (3-D) space. To improve the efficiency of algorithm, structure with linked list data is used to store etched cell. With the improvement of the storage mode, a 3-D cellular matrix can be stored in 2-D Array. The result of simulation is displayed with OpenGl 3-D technology. The glass etching simulation program based on common personal computer platforms has been realized with high resolution(4000×4000 Pixels)and visualizing results in 3-D space. The results of etching experiments are used as comparison to assess the implementations, which show that the model is able to forecast the result of etching glass. This study shows that 3-D CA model is an effective solution to the glass etching process task. Keywords glass chip; wet etching; cellular automata; OpenGL 3-D technology; computer simulation Background The work is supported by the National Natural Science Foundation of China under grant No.50605006: "Fracture Mechanism of Metal Film Microelectrodes under Spatial Stress and Solving Methods". During the course of thermal bonding of polymer microfluidic chips with electrochemical detection, metal film microelectrodes on the chip are liable to fracture on the boundaries between the cover plate and the substrate plate. The fracture mechanism is studied by the fractographic analysis method. In order to resolve the fracture problem, a novel thermal bonding method is first put forward and studied. To the best of our know, there are no similar reports. The research of this project will accelerate the mass production and practicality of polymer microfluidic chips with electrochemical detection, and hold great theoretical and practical values for the packaging of polymer micro-electromechanical systems.